Laser Sub-Systems


Sub-Systems for Cutting	Sub-Systems for Drilling	Sub-Systems for Marking/Engraving
Coherent manufactures an extremely diverse range of laser-based sub-systems for cutting. This ranges from ultrashort pulse lasers, for cutting thermally sensitive or hard to machine materials (such as ceramics, sapphire and glass) with essentially no heat affected, through nanosecond pulse width sources for rapid, cost effective cutting of wafers in microelectronics fabrication.	Coherent manufactures an extremely diverse range of laser-based sub-systems for drilling. This ranges from ultrashort pulse lasers, for drilling thermally sensitive or hard to machine materials (such as ceramics, sapphire and glass) with essentially no heat affected, through high power fiber lasers for high speed drilling of metals.	Coherent laser-based sub-systems for marking and engraving service a wide range of diverse applications. These include packaging, jewelry manufacture, microelectronics fabrication, electronics production, automotive manufacturing, and medical device manufacturing to name just a few.


Sub-Systems for Surface Structuring/ Ablating/Cleaning/ Scribing	Sub-Systems for Welding	Processing Heads
Coherent laser-based sub-systems service a broad range of surface structuring, ablation, cleaning, and scribing applications. These includes processes in microelectronics fabrication, medical device manufacturing and machine tool production to name just a few.	Coherent supports a diverse range of both plastic and metal welding applications with a variety of laser-based sub-systems. Our primary focus is on delivering solutions that enhance productivity, increase yields, lower production costs, and integrate seamlessly into your existing production environment.	Coherent processing heads sub-systems enhance productivity and improve the quality of results in a variety of materials processing applications. These includes welding, cutting, and drilling systems based on high-power fiber lasers and solid state lasers.